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Julien Ardelean
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22 avenue Emile Zola
75015 Paris FRANCE
Phone : +33.950.25.45.65
Fax : +33.955.25.45.65
Mobile: +33.6.15.14.89.64
Email: julien.ardelean@free.fr
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HIGHLIGHTS /
SKILLS
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Business Line
Engineering, Operations Management and Design Director
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Senior EPM/PMO of
Complex International Projects
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Business Development,
Marketing and Service Management
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IC Development Solution
Provider and Ramping-up Technology Organizations
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Smart Sensors and
Semiconductor Analog/Mixed-Signal IC Design since 1980
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EXPERIENCE
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NXP Semiconductors
GERMANY and FRANCE 2016 - present
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Senior EPM
Project/Program Management - BU
Automotive – BL Car IDA & BL ADAS
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S-band RF
tuner development, ADPLL and Synthesizer development WPL
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ADAS –
Radar and Sensors development, entire system solution
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Projects
management - PMO
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Due
diligence, plan development & implementation, go-to-market
approach drafting
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Target
alignments, conflict resolution
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Julien Ardelean
Consulting
IC Development Solution Provider
Paris, FRANCE 1999 - 2018
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Smart
Sensors and Semiconductor Analog/MS IC Development Solution Provider
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Smart
Sensors & IC Business Development, Marketing, Proposals
Negotiations
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Business
Administration, Program management, Engineering and Operations
management
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Major
clients include: Cadence Design Systems, STMicroelectronics/Accent,
Infineon Technologies AG, NXP Semiconductors GmbH, Coventor, Robert Bosch GmbH, ON Semiconductor, SORIN GROUP CRM (now LivaNova), CERN, ESRF, ACCO Semi, TranSwitch
Inc., iRoC Technologies, ams, TTTech,
Intertechnique
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ZODIAC AEROSPACE - INTERTECHNIQUE
FRANCE
2012 - 2015
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European
Defense Program - Observation and Warfare Drones Guidance Systems
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Strategy development
and strategic analysis; target screening
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Senior
Technical Program Management; Projects management
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Due
diligence, business plan development, contract drafting
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Negotiation,
conflict resolution
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INFINEON TECHNOLOGIES AG
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AUSTRIA, GERMANY, CHINA 2011 - 2012
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New
Digital SiMic Products Roadmap for Consumer
Applications
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Program
management(engineering and operations) for 65dB+ SNR SiMic families
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Coordination
Design Teams and Product Engineers for a System Approach
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Recovered
failing system projects - 30ME in revenue for product lifecycle
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Improved
development lifecycle by factor of 3; Increased product yield
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Senodia Technologies Co. Ltd.
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VP of R&D
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Shanghai, CHINA
2010 - 2011
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Inertial Motion
Detection Systems Z-axis gyro and 3-axis gyro systems
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Business Development and
New Products Roadmap for 6-axis IMU solution
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Automotive Applications
Fail-Safe Systems with Yaw-axis gyro & 3 DOF accel.
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Reinforced compliance
with ISO/TS19649 for Automotive products and Quality
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Program, engineering
management; Coordination Design & Product Engineers
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SORIN Group CRM, SAS.
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Clamart, FRANCE 2009 - 2010
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Advanced
Smart Sensors and Human Heart Pacing Leads Solutions
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MEMS based
Sonar Detection System of the human heart valves closure
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New Products
for 2 and 3 wires pacing leads inside the human heart
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Program
and engineering management; solved bottlenecks in development cycles
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Increased
the first pass success rate
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TTTech Computertechnik AG
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Vienna, AUSTRIA 2007 - 2009
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DO-254
Certification Solution Provider
Program
management, engineering and operations management; Setup a new Design
Center
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Avionics
and Automotive Applications
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Proved
& enforced compliance with DO-254 standard; guarantee first pass
hit
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Program
management, engineering and operations management
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Setup a
new Design Center
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Cadence Design Systems, SAS
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Vélizy, FRANCE
2004 - 2006
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Security
Sensors for Smart Cards - Solution Provider
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Smart
Cards Applications for Third Parties
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Program
and engineering management; insuring first pass success rate
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Solved bottlenecks
in the design cycle
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Catalyst Semiconductors - now ON
Semiconductor, Inc.
San José, USA
2002 - 2003
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Analog
Design Process Optimization Diligence
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EDA Flow Assessment
and Improvement Proposals
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Analog
Design Reviews: reducing design cycle by factor of 3
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Program
Management and Engineering Management
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Coventor, Inc.
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Paris, FRANCE
2001 - 2002
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IC Design
Services for MEMS Applications
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MEMS and
Sensors for Optics Applications - Targeted Project Evaluation
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Project
Management for Service Projects
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Technical
Solutions Proposals
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ST Microelectronics / Accent
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Milan, ITALY
1999 - 2001
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Analog/Mixed-Signal
Service Area Manager
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Smart
Sensors for Automotive Applications
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Program
Management and Design Management
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Business
Development
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CADENCE DESIGN SYSTEMS
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Analog and Back-End Design Group Manager,
Project Manager
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Vélizy, FRANCE
1996 - 1999
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Analog & Back-End
Design Group Manager
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Business Development; Reengineering;
Design Process Optimization projects
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Project Manager and
Principal Consultant (Analog/MS Front-to-Back Design Services)
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Resource management and
coordination for the analog/digital back-end consultants team
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Several IC analog/mixed-signal
projects: in smart sensors, automotive, E2PROM, smart-card, data
transmission, telecom and multimedia
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IN2P3 / LAL
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IC Design Group Manager
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Orsay, FRANCE
1989 - 1996
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IC Design Group Manager:
research engineers team management;
project definition and negotiation; full-custom analog/MS IC design
for High-Energy Physics experiments using different technologies
from several vendors (STM, Vitesse, Alcatel,
AMS, Orbit)
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Mixed-signal RadHard SOI technology development, for Atmel
production
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Over 30 designs,
production quantities for CERN experiments; quality/reliability
insurance
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Circuit functions:
low-noise charge/current preamplifiers, large-bandwidth amplifiers,
shapers, discriminators, analog pipeline memory, ADCs, etc.
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ANDA Sarl
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IC Development Consultant
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Paris, FRANCE
1988 - 1989
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Architecture design for matrix
addressing of public transportation
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Logic simulations on
Daisy CAD software.
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JAEGER-VEGLIA
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ASIC Design Engineer for Automotive Applications
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Levallois-Perret, FRANCE 1988
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Team member, development
responsibility for 2 IC designs representing
the analog part of a board processor
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Developments made on
Daisy Vlab simulator
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Foundry services from
Texas Instruments and Motorola
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MICROELECTRONICA
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Head of CMOS ICs Development Division
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Bucharest, ROMANIA 1982 - 1987
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Prototype design
management and fabrication(STM process) management;
Customer support
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27 type of IC in
different technologies;
CMOS ASIC library design and support
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SPICE simulator
implementation and support
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IPRS BANEASA
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Design Engineer for Bipolar ICs
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Bucharest, ROMANIA 1980 - 1982
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Several types of bipolar
OpAmp, voltage references, etc.
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Bipolar transistor
modeling software programs development
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EDUCATION
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SAP
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Project Management Training and Certification
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San José, CA USA
1998
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January 1998
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SAP R/3 Super User for
the Project Management module
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PA Consulting
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Project Management Training and Certification
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London, UK
1996 - 1997
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Project Management
courses and PMP-PMI Certification
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Change Management
Mastership
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EUROCHIP
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Advanced Analog Digital Design Course
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Louvain-la-Neuve,
BELGIUM 1995
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Advanced analog and
digital front-end design techniques;
low-power, low-current design techniques for communications
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Advanced analog back-end
design
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IN2P3 / CNRS
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Advanced Summer School on HEP Detectors
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La-Londe-les-Maures,
FRANCE 1991
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High-Energy Physics
Detectors architecture
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Advanced description of
LEP experiments at CERN, Geneva
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CAD Tools Providers
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Several CAD Tools User Courses
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FRANCE
1986 - 1996
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User courses from:
SILVAR-LISCO, DAISY, CALMA, VALID, COMPAS, MENTOR-GRAPHICS, AVANT!,
CADENCE DESIGN SYSTEMS
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Polytechnic Institute / University of Bucharest
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Artificial Intelligence Course
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Bucharest, ROMANIA 1984
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Artificial Intelligence
concepts;
New generation computers architecture;
Advanced programming languages and syntax (LISP, Prolog)
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Polytechnic Institute / University of Bucharest
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MSc and Engineer Degrees
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Bucharest, ROMANIA 1980
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Electronics/Microelectronics
degree - Electronics/Telecommunications Dept.
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Summa cum laude (GPA
10/10)
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MISCELLANEOUS
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Several technical
publications; holds one patent
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Teaching experience at
university level;
currently associate professor at ISEP (Paris, FRANCE)
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Born July 17th, 1956
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